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Paul S
San Diego, California, USA
Posts 2,658
Joined on 10-12-2006
Post #:
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24
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Post ID:
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22955
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Reply to:
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22952
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Only Because of the Bubbles...
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No doubt there are any number of ways to get a nice coating of natural shellac over clean, chemically neutral, soldered connections, but you did mention you have "bubbles", and there must be "chemical" reasons for this. I looked up the cleaner you are using, and there is no indication that it is alkaline, which a specialized flux remover should be, as far as I know. One first needs to remove the residual rosin (including scraping, as necessary), then one needs to neutralize the residual acids (from the flux). Then one can clean it in a way that leaves it "neutral". Then the traditional shellac (with denatured alcohol) can be applied in thin layers.
Here's a spec sheet I found on your cleaner. You can check your cleaner with litmus strips, of course. However you manage it, you are aiming at a clean and chemically "neutral" joint under the shellac, and no "bubbles".
http://docs-asia.electrocomponents.com/webdocs/136b/0900766b8136b1bf.pdf
Best regards, Paul S
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